印制电路信息2024No.1特种板SpecialPCB基于高分子电压诱导变阻膜的全PCB抗脉冲防护刘辉1吴丰顺1武占成2龚德权3王晶3胡元伟3马浩轩3（1.华中科技大学材料科学与工程学院，湖北武汉430074；2.中国航天五院五一四所院士专家工作站，北京100086；3.武汉芯宝科技有限公司，湖北武汉430043）摘要随着芯片集成度的不断提高，内部互连导线间距越来越小，器件更易在静电作用下受到损害。为提高印制电路板（PCB）在实际应用中抗静电放电（ESD）和电磁脉冲（EMP）的能力，制作了一种高分子电压诱导变阻膜，将其嵌入PCB中形成脉冲吸收网络，使全板具备抗瞬变脉冲能力，实现对ESD和EMP的全系统防护。ESD防护实测结果表明，对比普通PCB，全抗脉冲PCB对静电脉冲有更快的响应速度和更高的释放效率；传输线脉冲（TLP）测试结果表明，采用电压诱导变阻膜的PCB中每一点都具有过电压脉冲吸收能力，电流泄放能力可达50A以上。关键词静电放电（ESD）；传输线脉冲（TLP）测试；电磁脉冲（EMP）；变阻膜中图分类号：TN41文献标志码：A文章编号：1009⁃0096（2024）01⁃0021⁃05Anti-pulseprotectionofwholecircuitboardbasedonpolymervoltage-inducedrheostaticfilmLIUHui1WUFengshun1WUZhancheng2GONGDequan3WANGJing3HUYuanwei3MAHaoxuan3(1.SchoolofMaterialsScienceandEngineering,HuazhongUniversityofScienceandTechnology,Wuhan430074,Hubei,China;2.514AcademicianExpertWorkstation,theFifthAcademyofChinaAerospaceScienceandTechnology,Beijing100086,China;3.WuhanChipProtectionTechnologyCo.,Ltd.,Wuhan430043,Hubei,China)AbstractWiththecontinuousimprovementofchipintegration,theinterconnectwirespacingbecomessmallerandsmaller,sothedeviceismorevulnerabletoelectrostaticdamage.Inordertoimprovetheabilityoftheprintedcircuitboard(PCB)toresistelectrostaticdischarge(ESD)andelectromagneticpulse(EMP)inpracticalapplications,apolymervoltage-inducedrheostaticfilmispreparedandembeddedintothePCBtoformapulseabsorptionnetwork,sothattheentirecircuitboardhastheabilitytoresisttransientpulseandrealizethewholesystemprotectionagainstESDandEMP.ThemeasuredresultsofESDprotectionshowthatcomparedwiththeordinarycircuitboard,thefullresistancepulsecircuitboardhasfasterresponsespeedandhigherreleaseefficiencytotheelectrostatic...
