ApplicationReportSLMA002G–November1997–RevisedJanuary2011PowerPAD™ThermallyEnhancedPackageStevenKummerl...............................................................................................................................ABSTRACTThePowerPAD™thermallyenhancedpackageprovidesgreaterdesignflexibilityandincreasedthermalefficiencyinastandardsizedevicepackage.ThePowerPADpackage’simprovedperformancepermitshigherclockspeeds,morecompactsystemsandmoreaggressivedesigncriteria.PowerPAD™packagesareavailableinseveralstandardsurfacemountconfigurations.Theycanbemountedusingstandardprinted-circuitboard(PCB)assemblytechniques,andcanberemovedandreplacedusingstandardrepairprocedures.TomakeoptimumuseofthethermalefficienciesdesignedintothePowerPAD™package,thePCBmustbedesignedwiththistechnologyinmind.InordertoleveragethefullthermalperformancebenefitsofferedfromthePowerPad™package,theexposedpadmustbesolderedtotheboard.ThisdocumentfocusesonthespecificsofintegratingaPowerPAD™packageintothePCBdesign.Contents1Introduction..................................................................................................................22InstallationandUse.........................................................................................................33Assembly...................................................................................................................124Repair.......................................................................................................................155Summary...................................................................................................................16AppendixADefinitionsandModeling........................................................................................17AppendixBReworkProcessforHeatSinkTQFPandTSSOPPowerPAD™Packages-fromAir-VacEngineering.......................................................................................................................24AppendixCPowerPAD™Proce...
