-30-印制电路信息2023No.8特种板SpecialPCB超厚铜半埋型PCB制造技术研究卢赛辉吴永德侯代云张建林（惠州中京电子科技有限公司，广东惠州519029）摘要超厚铜多层印制电路板（PCB）产品应用于强电流连接传输及强弱电混合连接的部件。探究一种埋入式的0.49mm超厚铜PCB制作技术，其产品应用于新能源系统及新式大型智能装备总线等具有大电流特点的设备。控深蚀刻技术可解决超厚铜板图形制作的蚀刻难点，多层板压合白斑、分层及流胶异常问题，超厚铜的多次电镀、多次干膜制作及阻焊图形制作有高低差等困难。超厚铜产品制作技术起源于北美地区，国内涉及较少。利用该技术方法成功完成超厚铜多层板制作，为国内未来特殊的多层超厚铜板制作提供基础。关键词超厚铜；压合；控深蚀刻；阻焊中图分类号：TN41文献标志码：A文章编号：1009-00962023)08-0030-03ResearchonmanufacturingtechnologyofultrathickcopperhalfburiedPCBLUSaihuiWUYongdeHOUDaiyunZHANGJianlin(HuizhouChinaEagleElectronicTechnologyCo.,Ltd.,Huizhou519029,Guangdong,China)AbstracttUltrathickcoppermultilayerprintedcircuitboard(PCB)productsareappliedtocomponentswithstrongcurrentconnectiontransmissionandmixedstrongandweakcurrentconnection.Thisarticlemainlyexploresa0.49mmultrathickcopperPCB.productiontechnology.Itsproductapplicationsincludenewenergysystems,newlarge-scaleintelligentequipmentbuses,etc.,whichhavethecharacteristicsofhighcurrent.Usingdepthcontrolledetchingtechnologycansolvetheetchingdifficultiesintheproductionofultrathickcopperplategraphics,effectivelysolvingtheproblemsofwhitespots,layering,andabnormalglueflowinmulti-layerplatepressing,solvingthedifficultiesofmultipleelectroplatinganddryfilmproductionofultrathickcopper,andsolvingthedifficultiesofheightdifferencesintheproductionofsoldermaskgraphics.TheproductiontechnologyofultrathickcopperproductsoriginatedinNorthAmericaandislessinvolvedinChina.Usingthistechnicalmethod,wehavesuccessfullycompletedtheproductionofultrathickcoppermulti-layerplates,providingafoundationforthefutureproductionofspecialmulti-layerultrathickcopperplatesinChina.Keywordsultrathickcopper;pressing;depthcontrolledetching;soldermask作者简介：卢赛辉（199...
