2023.02ELECTRONICSQUALITY军用装备0201元件的组装工艺研究邴继兵，巫应刚，杨伟，黎全英，毛久兵（中国电子科技集团公司第三十研究所，四川成都610041）摘要：随着电子产品向小型化、高集成度方向发展，片式元件也在进一步地小型化。作为这一趋势的结果，0201无源元件成为了无数电子产品选择的解决方案，因为它在产品小型化与功能方面提供了极大的改善。为了满足军工电子产品小型化需求，开展了0201封装电阻、电容焊接工艺技术研究。对0201封装元器件焊接合格率的影响因素如焊盘设计、钢网设计、回流焊接参数和焊膏选择等展开了试验探索，运用交叉验证方法，对设计样件进行了工艺方案验证和数据分析，最后得出了0201封装元器件的最佳焊接工艺。关键词：0201元件；组装工艺；电阻；电容；；焊盘设计；钢网设计；回流焊接；交叉验证中国分类号：TN4.5文献标识码：A文章编号：1003-0107（2023）02-0063-06doi:10.3969/j.issn.1003-0107.2023.02.014ResearchontheAssemblyTechnologyof0201ComponentsofMilitaryEquipmentBINGJibing，WUYinggang，YANGWei，LIQuanying，MAOJiubing（The30thResearchInstituteofChinaElectronicsTechnologyGroupCorporation，Chengdu611730，China）Abstract：Withthedevelopmentofelectronicproductsinthedirectionofminiaturizationandhighintegrationdirection，chipcomponentsarefurtherdevelopinginthedirectionofminiaturization.Asaresultofthistrend，0201passivecom-ponentshavebecomethesolutionofchoiceforcountlesselectronicproducts，becauseitprovidesagreatimprove-mentinproductminiaturizationandfunction.Inordertomeetthedemandofminiaturizationofmilitaryelectronicprod-ucts，resistanceandcapacitanceweldingtechnologyof0201packageisstudied.Theinfluencingfactorsofweldingqualifiedrateof0201packagingcomponents，suchasweldingdiscdesign，steelmeshdesign，reflowweldingpa-rameters，andweldingpasteselection，aretestedandexplored.Byusingthecross-validationmethod，theprocessschemeverificationanddataanalysisarecarriedoutonthedesignsamples，andfinallytheoptimalweldingprocessof0201encapsulationcomponentsisobtained.Keywords：0201component；assemblytechnology；resistance；capacitance；paddesign；stencildesign；reflowsoldering；cross-validation收稿日期：2022...
