第39卷第3期2023年6月Electro-MechanicalEngineering·环境适应性设计·DOI:10.19659/j.issn.1008–5300.2023.03.008均温板复合微通道液冷板的设计与性能研究*刘帆1,2，范皓龙1,2，李帅1,2，郑笑天1,2，周晓东1,2（1.移动网络和移动多媒体技术国家重点实验室，广东深圳518055；2.中兴通讯股份有限公司，广东深圳518055）摘要：为解决高功耗和高热流密度芯片的散热问题，设计了一款新组合形态的液冷板——均温板（VaporChamber,VC）复合微通道液冷板。首先介绍了均温板复合微通道液冷板的设计方法，接着开展了仿真评估，最后进行了测试及回归分析。测试结果表明：VC复合微通道冷板能解决单芯片功耗650W、热流密度100W/cm2的散热问题，此时VC复合微通道液冷板底面温度为63.3◦C，热阻只有2.815E−2◦C/W。同时，在一定范围内，随着热源功耗的增加，液冷板热阻减小，散热效果提升。关键词：均温板；微通道液冷板；热阻中图分类号：TK124文献标识码：A文章编号：1008–5300(2023)03–0035–05DesignofandPerformanceResearchonVaporChamberCompositeMicrochannelColdPlateLIUFan1,2,FANHaolong1,2,LIShuai1,2,ZHENGXiaotian1,2,ZHOUXiaodong1,2(1.StateKeyLaboratoryofMobileNetworkandMobileMultimediaTechnology,Shenzhen518055,China;2.ZhongxingTelecommunicationEquipmentCorporation,Shenzhen518055,China)Abstract:Inordertosolvetheheatdissipationofchipswithhighpowerconsumptionandhighheatflux,anewcombinedtypeofliquidcoolingplate—vaporchamber(VC)compositemicrochannelcoldplateisdesigned.Firstly,thedesignmethodoftheVCcompositemicrochannelcoldplateisintroduced,thenthesimulationevaluationiscarriedout,andfinallythetestandregressionanalysisarecarriedout.ThetestresultsshowthattheVCcompositemicrochannelcoldplatecansolvetheheatdissipationproblemof650Wsinglechippowerconsumptionand100W/cm2heatflux.Inthiscase,thetemperatureofthebottomsurfaceoftheVCcompositemicrochannelcoldplateis63.3◦Candthethermalresistanceisonly2.815E−2◦C/W.Inaddition,withinacertainrange,asthepowerconsumptionoftheheatsourceincreases,thethermalresistanceoftheliquidcoolingplatedecreasesandtheheatdissipationeffectbecomesbetter.Keywords:vaporchamber;microchannelcoldplate;thermalresistance引言随着通讯技术的快...
