IEC62047-9Edition1.02011-07INTERNATIONALSTANDARDNORMEINTERNATIONALESemiconductordevices–Micro-electromechanicaldevices–Part9:WafertowaferbondingstrengthmeasurementforMEMSDispositifsàsemiconducteurs–Dispositifmicroélectromécaniques–Partie9:MesuredelarésistancedecollagededeuxplaquettespourlesMEMSIEC62047-9:2011®colourinsideCopyrightedmateriallicensedtoBRDemobyThomsonReuters(Scientific),Inc.,subscriptions.techstreet.com,downloadedonNov-28-2014byJamesMadison.Nofurtherreproductionordistributionispermitted.UncontrolledwhenprinteTHISPUBLICATIONISCOPYRIGHTPROTECTEDCopyright©2011IEC,Geneva,SwitzerlandAllrightsreserved.Unlessotherwisespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromeitherIECorIEC'smemberNationalCommitteeinthecountryoftherequester.IfyouhaveanyquestionsaboutIECcopyrightorhaveanenquiryaboutobtainingadditionalrightstothispublication,pleasecontacttheaddressbeloworyourlocalIECmemberNationalCommitteeforfurtherinformation.Droitsdereproductionréservés.Saufindicationcontraire,aucunepartiedecettepublicationnepeutêtrereproduiteniutiliséesousquelqueformequecesoitetparaucunprocédé,électroniqueoumécanique,ycomprislaphotocopieetlesmicrofilms,sansl'accordécritdelaCEIouduComiténationaldelaCEIdupaysdudemandeur.SivousavezdesquestionssurlecopyrightdelaCEIousivousdésirezobtenirdesdroitssupplémentairessurcettepublication,utilisezlescoordonnéesci-aprèsoucontactezleComiténationaldelaCEIdevotrepaysderésidence.IECCentralOffice3,ruedeVarembéCH-1211Geneva20SwitzerlandEmail:inmail@iec.chWeb:www.iec.chAbouttheIECTheInternationalElectrotechnicalCommission(IEC)istheleadingglobalorganizationthatpreparesandpublishesInternationalStandardsforallelectrical,electronicandrelatedtechnologies.AboutIECpublicationsThetechnicalcontentofIECpublicationsiskeptunderconstantreviewbytheIEC.Pleasemakesurethatyouhavethelatestedition,acorrigendaoranamendmentmighthave...
