IEC60749-20-1Edition1.02009-04INTERNATIONALSTANDARDNORMEINTERNATIONALESemiconductordevices–Mechanicalandclimatictestmethods–Part20-1:Handling,packing,labellingandshippingofsurface-mountdevicessensitivetothecombinedeffectofmoistureandsolderingheatDispositifsàsemiconducteurs–Méthodesd'essaismécaniquesetclimatiques–Partie20-1:Manipulation,emballage,étiquetageettransportdescomposantspourmontageensurfacesensiblesàl'effetcombinédel'humiditéetdelachaleurdebrasageIEC60749-20-1:2009®LICENSEDTOMECONLimited.-RANCHI/BANGALOREFORINTERNALUSEATTHISLOCATIONONLY,SUPPLIEDBYBOOKSUPPLYBUREAU.THISPUBLICATIONISCOPYRIGHTPROTECTEDCopyright©2009IEC,Geneva,SwitzerlandAllrightsreserved.Unlessotherwisespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromeitherIECorIEC'smemberNationalCommitteeinthecountryoftherequester.IfyouhaveanyquestionsaboutIECcopyrightorhaveanenquiryaboutobtainingadditionalrightstothispublication,pleasecontacttheaddressbeloworyourlocalIECmemberNationalCommitteeforfurtherinformation.Droitsdereproductionréservés.Saufindicationcontraire,aucunepartiedecettepublicationnepeutêtrereproduiteniutiliséesousquelqueformequecesoitetparaucunprocédé,électroniqueoumécanique,ycomprislaphotocopieetlesmicrofilms,sansl'accordécritdelaCEIouduComiténationaldelaCEIdupaysdudemandeur.SivousavezdesquestionssurlecopyrightdelaCEIousivousdésirezobtenirdesdroitssupplémentairessurcettepublication,utilisezlescoordonnéesci-aprèsoucontactezleComiténationaldelaCEIdevotrepaysderésidence.IECCentralOffice3,ruedeVarembéCH-1211Geneva20SwitzerlandEmail:inmail@iec.chWeb:www.iec.chAbouttheIECTheInternationalElectrotechnicalCommission(IEC)istheleadingglobalorganizationthatpreparesandpublishesInternationalStandardsforallelectrical,electronicandrelatedtechnologies.AboutIECpublicationsThetechnicalcontentofIECpublicationsiskeptunderconstantreviewbytheIEC.Pleasemakesurethatyou...
