电子工艺技术ElectronicsProcessTechnology182023年1月第44卷第1期摘要：以某国产150W大功率微砖电源模块为研究对象，将常压阶梯灌封工艺引入该系列产品，并获得了稳定的、批量一致性的工艺方案和灌封参数。根据产品独特的双腔结构及散热需求，选取某型号国产双组分高导热系数有机硅灌封胶作为灌封材料，保证灌封胶固化后的导热性能并兼顾了优异的弹性、抗冲击性能及良好的返工性。通过灌封工装的设计及相关参数的验证，优化了灌封流程，提升了灌封效率。通过多次试验及关键工艺过程控制，获得了无气泡和凹陷等灌封缺陷的产品，满足灌封质量要求。关键词：国产化；电源模块；阶梯灌封；批量一致性中图分类号：TN605文献标识码：Ａ文章编号：1001-3474（2023）01-0018-05Abstract:Takingadomestic150Whigh-powermicrobrickpowermoduleastheresearchobject,thesteppottingprocessisintroducedintothisseriesofproducts,andastableprocessschemeandpottingparameterswithbatchconsistencyareobtained.Accordingtotheuniquedoublecavitystructureandheatdissipationrequirementsoftheproduct,adomestictwo-componenthighthermalconductivitysiliconepottingadhesiveisselectedasthepottingmaterialtoensurethethermalconductivityofthepottingadhesiveaftercuring,andtakeintoaccounttheexcellentelasticity,impactresistanceandgoodrework.Throughthedesignofpottingtoolingandtheverificationofrelevantparameters,thepottingprocessisoptimizedandthepottingefficiencyisimproved.Throughmanytestsandkeyprocesscontrol,theproductswithoutbubble,depressionandotherpottingdefectsareobtained,whichmeetthequalityrequirementsofthepottingquality.Keywords:localization;powermodule;steppotting;batchconsistencyDocumentCode:AArticleID:1001-3474(2023)01-0018-05国产150W大功率微砖电源模块灌封工艺ResearchonPottingProcessofDomestic150WHighPowerMicroBrickPowerModule王同洋，刘园，周亚丽WANGTongyang,LIUYuan,ZHOUYali（中国电子科技集团公司第五十八研究所，江苏无锡214072）(The58thResearchInstituteofCETC,Wuxi214072,China)0引言DC-DC电源模块广泛用于电力电子、军工、科研、工控设备、通讯设备、仪器仪表、交换设备、接入设备、移动通讯、路由器等通信领域和工业控制、汽车电子、航空航天等领域。由于采用模块组建电源系统具有设...
