40卷第11期2023年11月引用格式：侯传涛，程昊，张跃平．基于云纹干涉法的封装结构应变测量技术研究[J].微电子学与计算机，2023，40(11)：143-148.[HOUCT,CHENGH,ZHANGYP.Researchonstrainmeasurementofpackagestructurebasedonmoireinterferometry[J].Microelectronics&Computer,2023,40(11):143-148.JD0I:10.19304/J.ISSN1000-7180.2023.0657摘要：随着高密度、高集成度封装技术的发展，封装结构的可靠性问题备受关注.本文基于云纹干涉法和Twyman/Green干涉法，结合四步相移技术，建立了一套高精度三维光学测量方法，能够实现封装结构在力、热载荷下离面和面内的变形测量.进一步采用多项式拟合后求导的方法,提升了传统差分法求应变的测量精度.最后通过标准试验件三点弯曲实验,验证了方法的测量精度,并通过该方法实现了典型球栅阵列(BallGridArray,BGA)封装结构在热载荷下的变形测量，测量结果与有限元仿真结果相比具有较好的一致性。本文基于光测力学方法获得了封装结构在力、热等载荷下的变形场和应变场，从而对提升封装结构的可靠性具有重要意义关键词：干涉方法；变形测量；应变测量；封装结构；封装可靠性中图分类号：TN406Researchonstrainmeasurementofpackagestructurebasedon(ScienceandTechnologyonReliabilityandEnvironmentEngineeringLaboratory,BeijingInstituteofStructureandAbstract:Withthedevelopmentofhighdensityandhighintegrationpackagingtechnology,thereliabilityofpackagingstructurehasattractedmuchattention.Inthispaper,acompactandhighsensitivity3DopticaltestingmethodisconstructedbyeffectivecombinationofMoireinterferometrywithTwyman/Greeninterferometryandbyimplementingphaseshifingtechnique.Inordertofurtherimprovethestainaccuracy,thediscretedeformationfieldobtainedbythephaseshifingtechnologyisfittedwithpolynomial,andthenthederivationisrealized.Themeasurementaccuracyofthemethodisverifiedbythethree-pointbendingexperimentofthestandardtestpiece,andthedeformationofthetypicalBallGridArray(BGA)packagestructureunderthermalloadisfinallymeasured.Thedeformationandstraininformationofpackagestructureunderthermalandforceloadscanbeobtainedbythemethod,whichisofgreatsignificancetoimprovethereliabilityofpackagestructure.Keywords:interferometrymethod;deformationmea...
