=================================DOI:10．13290/j．cnki．bdtjs．2023．03．013268半导体技术第48卷第3期2023年3月等离子清洗及点胶轨迹对底部填充胶流动性的影响翟培卓，洪根深，王印权，李守委，陈鹏，邵文韬，柏鑫鑫(中国电子科技集团公司第五十八研究所，江苏无锡214035)摘要:倒装焊封装过程中，底部填充胶的流动性决定了填充效率，进而影响生产效率及成本。通过对比接触角和底部填充胶流动时间，研究了等离子清洗及点胶轨迹对底部填充胶流动性的影响。结果表明:经微波等离子清洗后，水及底部填充胶在陶瓷基板表面的浸润性均有所提高;微波等离子清洗还能促进底部填充胶在芯片和陶瓷基板之间的流动。I形点胶轨迹对应的流动时间最长，而U形点胶轨迹的流动时间最短。因此适当增加点胶轨迹的总长度，可以有效提高底部填充胶的填充效率。关键词:微电子封装;等离子清洗;点胶轨迹;底部填充;流动性中图分类号:TN305.94文献标识码:A文章编号:1003－353X(2023)03－0268－04EffectsofPlasmaCleaningandDispensingPathontheFluidityofUnderfillAdhesiveZhaiPeizhuo，HongGenshen，WangYinquan，LiShouwei，ChenPeng，ShaoWentao，BaiXinxin(The58thResearchInstitute，CETC，Wuxi214035，China)Abstract:Duringtheflip-chippackageprocess，thefillingefficiencyisdeterminedbythefluidityofunderfilladhesive，whichfurtheraffectstheproductionefficiencyandcost．Theeffectsofplasmacleaninganddispensingpathonthefluidityofunderfilladhesivewereresearchedbycomparingthecontactangleandtheflowtimeofunderfilladhesive．Theresultsshowthatthewettabilityofwaterandunderfilladhe-siveonthesurfaceoftheceramicsubstratearebothimprovedaftermicrowaveplasmacleaning．Additionally，thefluidityofunderfilladhesivebetweenthechipandceramicsubstrateisbetteraftermicrowaveplasmacleaning．TheflowtimeoftheI-shapeddispensingpathisthelongest．Inthecontrast，theflowtimeoftheU-shapeddispensingpathistheshortest．Thereforethefillingefficiencyofunderfilladhesivecanbeimprovedeffectivelybyincreasingthetotallengthofdispensingpathappropriately．Keywords:microelectronicpackaging;plasmacleaning;dispensingpath;underfill;fluidityEEACC:22400引言倒装焊封装技术以倒装芯片的凸点作为连接媒介，采用回流焊、热压焊等实现芯片与基...
